ChangXin Memory Technologies (CXMT) is projected to reach 350,000 wafer starts per month (WSPM) by 2026, nearing Micron's capacity. This advancement positions China as the potential second-largest DRAM producer globally, driven by government initiatives and domestic technology transfers.
According to Citrini Research, CXMT is on track to achieve approximately 350,000 wafer starts per month by 2026. This will position CXMT very close to Micron, which is a significant milestone for China's DRAM manufacturing capabilities.
The Chinese federal government is encouraging CXMT to share its technology with other companies such as JHICC, Swaysure, and XMC. These companies are either building their own DRAM capacities or planning to do so, which could collectively enhance China's output significantly in the coming years.
When all anticipated facilities become operational, China's total production could reach 600,000 WSPM, which is substantial but still below South Korea's capacities. Furthermore, by 2030, CXMT expects to ramp its output to 950,000 WSPM, bolstered by new fabs in Beijing, Hefei, and Shanghai.
Despite the positive forecast for CXMT and other Chinese manufacturers, significant challenges remain. The ability to acquire advanced lithography tools could hinder production growth, especially if regulations restrict these sales to select Chinese companies. The landscape remains dynamic and focused on technological advancements within the country.
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ChangXin Memory Technologies (CXMT) is projected to reach 350,000 wafer starts per month (WSPM) by 2026, nearing Micron's capacity. This advancement positions China as the potential second-largest DRAM producer globally, driven by government initiatives and domestic technology transfers.