AMD CEO Lisa Su visited South Korea to meet with Samsung executives, aiming to secure additional High Bandwidth Memory (HBM) supply for AMD's AI accelerators. This visit occurs less than seven months after AMD and Samsung signed a memorandum of understanding (MOU) regarding memory supply and collaboration.
Samsung is reportedly seeking a broader partnership with AMD, hoping to expand their relationship beyond memory supply to include foundry chip production orders. Lisa Su confirmed discussions about a 'broader partnership' with Samsung executives, acknowledging Samsung as a key partner.
During her visit, Su emphasized the strategic importance of memory makers like Samsung and SK Hynix to AMD's AI and data center businesses. She noted the high demand for AI and the necessity of long-term supply chain planning, looking three to five years ahead with partners.
The non-binding MOU signed in March outlined four key areas of collaboration: supply of next-generation memory products (including HBM4 and advanced DDR5), co-development of memory solutions for AI and high-performance computing, exploration of foundry manufacturing opportunities for future AMD platforms, and co-optimization of advanced packaging technologies.
While Samsung is a principal supplier of HBM4 for AMD's Instinct MI400-series accelerators, expanding collaboration into foundry services presents complexities. This involves significant effort to design chips for Samsung Foundry's process technologies and carries risks associated with product ramp-up at a new contract chipmaker. AMD currently uses Samsung Foundry for programmable logic devices, but moving more advanced product production is a larger undertaking.
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AMD CEO Lisa Su visited Samsung in South Korea to discuss securing additional High Bandwidth Memory (HBM) for AI accelerators. Samsung is seeking to expand its partnership with AMD beyond memory supply to include foundry chip production orders. This visit follows a March MOU between the companies covering memory supply, co-development, foundry exploration, and advanced packaging.