OpenAI and Synopsys announced a multi-year agreement on September 30 to jointly develop GPT-Synopsys. This specialized AI model will be optimized for semiconductor design, integrating OpenAI's AI capabilities with Synopsys's industry-leading electronic design automation (EDA) tools and agentic AI capabilities. The goal is to revolutionize the semiconductor design process.
The collaboration intends for engineers to delegate design tasks to AI agents. These agents will operate the EDA tools and execute necessary processes, preparing work for human review. This approach is expected to allow design teams to explore more options and create more sophisticated chips. OpenAI will license Synopsys's tools for model development, which will run on OpenAI-hosted infrastructure. The companies plan to jointly release the product and share revenue, though no release date or pricing has been disclosed.
EDA tools are essential for designing and verifying chips before manufacturing. The process involves multiple stages, including hardware description in RTL code, synthesis into logic gates, physical layout, and final verification for power, performance, and silicon area (PPA). Synopsys, Cadence, and Siemens EDA are major players in this market. AI has been increasingly integrated into chip design to optimize these complex, iterative processes.
Synopsys has previously introduced AI solutions for chip design. In March 2020, the company launched DSO.ai, a reinforcement learning tool designed to improve PPA by learning from past design optimizations. More recently, in November 2023, Synopsys released Synopsys.ai Copilot, which integrates generative AI through a collaboration with Microsoft and Azure OpenAI service to provide natural language assistance within its engineering tools. The company also showcased its Agentic AI direction at the Design Automation Conference in July.
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OpenAI and Synopsys have partnered to create GPT-Synopsys, an AI model optimized for semiconductor design using Synopsys's electronic design automation (EDA) tools. This collaboration aims to enable engineers to delegate design tasks to AI agents, allowing for more sophisticated chip development and evaluation of more design options.