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Sandisk and SK hynix Release High Bandwidth Flash (HBF) Specification via OCP
Key points
- Sandisk and SK hynix released the HBF specification via OCP.
- HBF combines 3D NAND non-volatility with HBM performance.
- Initial HBF packages offer up to 512GB capacity.
- Bandwidth ranges from 0.4 TB/s to 3.0 TB/s.
Introduction of High Bandwidth Flash (HBF)
Sandisk and SK hynix have formally introduced the High Bandwidth Flash (HBF) specification, a jointly developed storage technology. This specification was released through the Open Compute Project (OCP), establishing it as an open standard rather than a proprietary interface. HBF aims to merge the non-volatility of 3D NAND with the performance characteristics of High Bandwidth Memory (HBM), targeting applications such as AI inference systems.
Specification Details and Performance
The initial HBF specification defines packages with capacities up to 512GB, utilizing either 8-Hi or 16-Hi NAND die stacks. These are specialized devices with fast interfaces, referred to by Sandisk as HBF core dies. Performance is categorized into three bandwidth grades, ranging from approximately 0.4 TB/s to 3.0 TB/s. The highest performance tier of HBF (3 TB/s) is designed to exceed the memory bandwidth of a single HBM4 stack (2 TB/s), though HBM4 is expected to maintain a latency advantage.
Integration and Roadmap
SK hynix states that HBF uses the Universal Chiplet Interconnect Express (UCIe) standard for integration with heterogeneous computing platforms. Sandisk indicates HBF will adopt the 'xPU-HBF' interface, which may be its interpretation of UCIe. The broad performance range suggests a multi-year roadmap for HBF, encompassing multiple implementations and generations. The specification also covers electrical and interface characteristics, packaging, reliability guidelines, and software I/O requirements for stacked HBF devices.
Technical Implementation
Achieving 400 GB/s of bandwidth from a single 512GB HBF package requires significant engineering. Sandisk previously outlined plans to use 16 HBF core dies, each with numerous arrays for concurrent access via dedicated read/write paths. Alternatively, over 400 GB/s per package can be achieved using a single UCIe interface operating at up to 64 GT/s across 64 lanes, which implies a complex HBF base die. Sandisk and SK hynix position HBF as a new memory tier.
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Reporting from
Sandisk and SK hynix have introduced the High Bandwidth Flash (HBF) specification through the Open Compute Project (OCP), combining 3D NAND non-volatility with HBM-like performance for AI inference systems. This open standard defines HBF packages with capacities up to 512GB and bandwidths ranging from 0.4 TB/s to 3.0 TB/s, aiming to provide a new memory tier for heterogeneous computing platforms.