Tom's Hardware Premium Highlights: China's Lithography, Co-Packaged Optics, and Samsung Memory

China's Semiconductor Manufacturing Ambitions

China is working to develop its own chipmaking tools, with a goal to build DUV immersion lithography machines capable of producing 7nm chips by 2030. This initiative is critical as the country currently relies on ASML's DUV machines, which are subject to export controls. The development of a domestic EUV machine is a more complex undertaking, reportedly involving over 3,000 workers in a project dubbed China's "Manhattan Project."

Beyond lithography, China's CXMT plans to expand its DRAM output by building a new fab. This expansion aims to meet demand from consumer brands and computer makers. However, the potential impact of the MATCH Act on CXMT's ability to produce DRAM modules on advanced nodes is a significant concern.

Advancements in Co-Packaged Optics

Co-packaged optics (CPO) are gaining attention as data center demands increase, particularly with the rise of AI accelerators requiring faster signaling speeds. CPO technology places optical engines directly next to processors or ASICs to shorten electrical paths, which increases data rates and reduces power consumption.

Major foundries like TSMC, Intel, Samsung Foundry, and GlobalFoundries are developing CPO roadmaps. TSMC's COUPE roadmaps extend to 2030, targeting lane speeds of 400 Gb/s. Intel is integrating OCI chiplets into its CPUs, while Samsung Foundry is working on a CPO turnkey solution, and GlobalFoundries is developing an OCI-MSA CPO platform.

Bench 2.0 Redesign

Tom's Hardware has redesigned its hardware benchmark database, now called Bench 2.0. This updated platform allows users to search and compare hardware benchmarks with granular detail, providing access to every benchmark run during product reviews. Bench 2.0 is an exclusive feature for Tom's Hardware Premium subscribers.