Bambu Lab Files Patent for New 3D Printer Heatbed Design to Reduce Print Peeling

New Heatbed Patent Application

Shenzhen Tuozhu Technology, the parent company of 3D printer manufacturer Bambu Lab, has filed a patent application in the U.S. for a new heatbed design. The application, published on September 10, 2026, details a system intended to provide more uniform heating across a 3D printer's build plate.

Addressing Print Adhesion Issues

The primary goal of this new design is to mitigate common issues such as print peeling, which users of various 3D printer brands frequently report. By ensuring more consistent heat distribution, the patent claims improved adhesion capabilities for the print panel, leading to better overall print quality.

Design Specifics

The patent abstract (US20260264331A1) describes a heated bed comprising a heated bed body, a heating unit, and a bottom case. The heating unit is positioned between the bed body and the bottom case, attached to the bed body's surface. Visuals within the patent show a monolithic heatbed with a machined channel, resembling the Chinese character '凹', through which a single, long heating element loops. This configuration allows the heating element to reach the corners of the bed, potentially reducing peeling for large prints and improving temperature attainment speed.

Manufacturing Considerations

While machining a recess into a large aluminum piece can be costly in terms of materials and manufacturing, the patent suggests possibilities for constructing the heated bed body from multiple pieces or layers of aluminum sheets. The design does not indicate independent heating zones.