● Covered by 4 sources · 15 reportsMedium impact14 neutral1 positive
TSMC and Samsung Commit to ASML's High NA EUV Chipmaking Tools
Key points
- TSMC and Samsung will use ASML's High NA EUV machines.
- High NA EUV machines print smaller, more intricate circuit patterns.
- Samsung plans to use the machines for DRAM production from 2028.
- The adoption is driven by demand for advanced chips for AI.
- TSMC will deploy ASML's High NA EUV tech by 2030.
- Samsung and TSMC will adopt larger 12-inch photomasks.
- 12-inch photomasks are expected in advanced node production by 2033.
- Intel has deployed ASML's High NA EUV technology on its 18A process.
- Intel used ASML's High NA EUV for Core Ultra Series 3 (Panther Lake) processors.
- Intel built over one million wafers using the new process.
- TSMC will use High-NA EUV for high-volume manufacturing.
- TSMC will use conventional 6x6-inch photomasks initially.
- TSMC will build a pilot line for 6x12-inch photomasks in 2031.
- The technology change could increase chip production by 40%.
- ASML's high NA EUV machines cost up to $400 million each.
- ASML explained the need for larger photomasks in a press release.
- High-NA EUV systems achieve an 8nm single-exposure resolution.
- Low-NA EUV scanners have a 13nm single-exposure resolution.
- ASML will not adopt free-electron laser (FEL) technology for EUV scanners.
- ASML will continue developing existing laser-produced plasma (LPP) systems.
- ASML will focus on increasing LPP light sources to 1000W.
- JPMorgan reported ASML's decision regarding FEL technology.
- EUV systems use CO2 laser pulses on molten tin droplets.
- Molten tin droplets are around 30 microns in diameter.
- Plasma emits 13.5-nm EUV radiation.
- A 0.5-meter elliptical collector mirror collects the light.
- ASML's revenue from Europe was 0% in 2026.
- ASML's revenue from Europe was 1% in 2025.
- ASML's revenue from Europe was 5% in 2024.
- ASML's revenue from Europe was 4% in 2023.
- ASML's revenue from Europe was 2% in 2022.
- ASML is valued at $660 billion.
- Frank Heemskerk is executive vice president of public affairs at ASML.
- Chinese chipmakers acquired 343 immersion DUV tools between 2012 and early 2026.
- Many DUV tools can produce 7nm-class chips.
- The Centre for Technology & Statecraft (CTS) reported on China's DUV tool accumulation.
- The CTS is a Washington-based group.
- Export controls have a gap, allowing DUV equipment for less advanced processes to be repurposed.
- TSMC's September revenue was $16.03 billion.
- TSMC's September revenue increased 54.6% year-over-year.
- TSMC's September revenue was down 0.6% from August.
- TSMC's third-quarter revenue was $1.49 trillion New Taiwan dollars.
- ASML's third-quarter profit exceeded expectations.
- ASML customers are interested in placing orders through 2029.
- ASML CEO is Christophe Fouquet.
- ASML raised its 2026 sales forecast.
- ASML's current supply for 2027 and 2028 will not fully meet demand.
- ASML is investigating ways to increase 2028 capacity beyond 30%.
- Elon Musk's Terafab will receive its first ASML EUV tool in mid-2027.
- Terafab's development shell will be completed in late 2027.
- Terafab's initial chip production will use Intel's 14A process.
- Terafab is located on the north campus of Giga Texas near Austin.
- Tesla broke ground on its research fab in April.
- ASML's Q3 2026 earnings were published on October 14.
- ASML will raise prices starting in 2027, with full effect in 2028.
- ASML's Q3 2026 net profit was —4.96 billion.
- ASML's Q3 2026 net sales were —11.7 billion.
- ASML projects Q4 sales of —14.2 billion to —15.2 billion.
- ASML boosted full-year sales projections from —43 billion to —44-45 billion.
- ASML's shares rose 2% on Wednesday.
- ASML's shares are up almost 70% so far this year.
- ASML's market valuation is —586 billion.
- ASML's Q3 2026 revenue was $13.06 billion USD.
- ASML's Q3 2026 revenue was up 55% year-over-year.
- ASML's Q3 2026 revenue was up 25% sequentially.
- ASML's gross margin reached 57.5%.
- ASML's operating income rose to $5.79 billion.
- ASML's net income reached $5.56 billion USD.
- ASML's net income includes $570 million from re-evaluation of Mistral AI investment.
- ASML sold 121 lithography systems in Q3 2026.
- ASML sold 113 new lithography systems in Q3 2026.
- ASML sold eight refurbished lithography systems in Q3 2026.
- ASML released a Lego kit of the TWINSCAN EXE:5000 in December 2024.
- The ASML Lego kit was employee-exclusive.
- The ASML Lego kit cost $230 on the official website.
- The ASML Lego kit sells for $500-$700 on eBay.
- X user @lithos_graphein created an 810-piece fan replica of the ASML Lego kit.
- The fan-made Lego replica includes interior details like vacuum pumps and a laser emitter.
- The fan-made Lego replica has a sliding silicon wafer tray.
- Chinese chip manufacturers produce advanced processors using DUV lithography.
- Huawei's Kirin 9000S and 9030 processors are made with DUV lithography.
- Multiple patterning techniques increase manufacturing complexity, cost, and defect rates.
- The EUV gap between China and the West is at least half a decade.
- Chris Mack is co-founder and CTO of Fractilia.
Chipmakers Adopt Advanced Lithography
TSMC and Samsung, major global chip manufacturers, have committed to integrating ASML's High NA extreme ultraviolet (EUV) lithography machines into their production processes. These machines are crucial for printing circuit patterns onto silicon wafers and can create smaller, more intricate designs. Each High NA machine costs approximately $400 million.
Samsung's DRAM Production Plans
Samsung, a leading memory chipmaker, announced its intention to utilize ASML's High NA EUV machines for producing DRAM, a key type of memory, starting in 2028. The company stated that adopting this technology by 2030 will extend the DRAM scaling roadmap and enhance manufacturing efficiency.
TSMC Focuses on AI Applications
TSMC will deploy ASML's tools for advanced chip manufacturing. The company anticipates an increase in the use of High NA machines, primarily due to the complex transistor architectures required for artificial intelligence (AI) applications. This aligns with the growing industry demand for more powerful chips to support AI development.
Industry Initiative for Photomask Technology
Both TSMC and Samsung will also participate with ASML in an industry initiative aimed at advancing next-generation 12-inch photomask technology. This represents an upgrade from the current 6-inch format. Photomasks serve as stencils for printing patterns on wafers, and a larger format is expected to improve productivity and reduce chipmaking costs.
Market and Capacity Outlook
Intel is already a customer for ASML's High NA machines, using the technology for advanced chip manufacturing. While ASML has not provided recent sales forecasts for these machines, it plans to increase its total EUV capacity by about 30% by 2027. Analysts view these commitments from TSMC and Samsung as providing greater clarity on adoption, which is seen as positive for ASML's future growth.
Updates
- Chinese chip manufacturers produce advanced processors using DUV lithography.
- Huawei's Kirin 9000S and 9030 processors are made with DUV lithography.
- Multiple patterning techniques increase manufacturing complexity, cost, and defect rates.
- The EUV gap between China and the West is at least half a decade.
- Chris Mack is co-founder and CTO of Fractilia.
- ASML released a Lego kit of the TWINSCAN EXE:5000 in December 2024.
- The ASML Lego kit was employee-exclusive.
- The ASML Lego kit cost $230 on the official website.
- The ASML Lego kit sells for $500-$700 on eBay.
- X user @lithos_graphein created an 810-piece fan replica of the ASML Lego kit.
- The fan-made Lego replica includes interior details like vacuum pumps and a laser emitter.
- The fan-made Lego replica has a sliding silicon wafer tray.
- ASML's Q3 2026 earnings were published on October 14.
- ASML will raise prices starting in 2027, with full effect in 2028.
- ASML's Q3 2026 net profit was —4.96 billion.
- ASML's Q3 2026 net sales were —11.7 billion.
- ASML projects Q4 sales of —14.2 billion to —15.2 billion.
- ASML boosted full-year sales projections from —43 billion to —44-45 billion.
- ASML's shares rose 2% on Wednesday.
- ASML's shares are up almost 70% so far this year.
- ASML's market valuation is —586 billion.
- ASML's Q3 2026 revenue was $13.06 billion USD.
- ASML's Q3 2026 revenue was up 55% year-over-year.
- ASML's Q3 2026 revenue was up 25% sequentially.
- ASML's gross margin reached 57.5%.
- ASML's operating income rose to $5.79 billion.
- ASML's net income reached $5.56 billion USD.
- ASML's net income includes $570 million from re-evaluation of Mistral AI investment.
- ASML sold 121 lithography systems in Q3 2026.
- ASML sold 113 new lithography systems in Q3 2026.
- ASML sold eight refurbished lithography systems in Q3 2026.
- Elon Musk's Terafab will receive its first ASML EUV tool in mid-2027.
- Terafab's development shell will be completed in late 2027.
- Terafab's initial chip production will use Intel's 14A process.
- Terafab is located on the north campus of Giga Texas near Austin.
- Tesla broke ground on its research fab in April.
- ASML's third-quarter profit exceeded expectations.
- ASML customers are interested in placing orders through 2029.
- ASML CEO is Christophe Fouquet.
- ASML raised its 2026 sales forecast.
- ASML's current supply for 2027 and 2028 will not fully meet demand.
- ASML is investigating ways to increase 2028 capacity beyond 30%.
- TSMC's September revenue was $16.03 billion.
- TSMC's September revenue increased 54.6% year-over-year.
- TSMC's September revenue was down 0.6% from August.
- TSMC's third-quarter revenue was $1.49 trillion New Taiwan dollars.
- Chinese chipmakers acquired 343 immersion DUV tools between 2012 and early 2026.
- Many DUV tools can produce 7nm-class chips.
- The Centre for Technology & Statecraft (CTS) reported on China's DUV tool accumulation.
- The CTS is a Washington-based group.
- Export controls have a gap, allowing DUV equipment for less advanced processes to be repurposed.
- ASML's revenue from Europe was 0% in 2026.
- ASML's revenue from Europe was 1% in 2025.
- ASML's revenue from Europe was 5% in 2024.
- ASML's revenue from Europe was 4% in 2023.
- ASML's revenue from Europe was 2% in 2022.
- ASML is valued at $660 billion.
- Frank Heemskerk is executive vice president of public affairs at ASML.
- ASML will not adopt free-electron laser (FEL) technology for EUV scanners.
- ASML will continue developing existing laser-produced plasma (LPP) systems.
- ASML will focus on increasing LPP light sources to 1000W.
- JPMorgan reported ASML's decision regarding FEL technology.
- EUV systems use CO2 laser pulses on molten tin droplets.
- Molten tin droplets are around 30 microns in diameter.
- Plasma emits 13.5-nm EUV radiation.
- A 0.5-meter elliptical collector mirror collects the light.
- ASML explained the need for larger photomasks in a press release.
- High-NA EUV systems achieve an 8nm single-exposure resolution.
- Low-NA EUV scanners have a 13nm single-exposure resolution.
- The technology change could increase chip production by 40%.
- ASML's high NA EUV machines cost up to $400 million each.
- TSMC will use High-NA EUV for high-volume manufacturing.
- TSMC will use conventional 6x6-inch photomasks initially.
- TSMC will build a pilot line for 6x12-inch photomasks in 2031.
- TSMC will deploy ASML's High NA EUV tech by 2030.
- Samsung and TSMC will adopt larger 12-inch photomasks.
- 12-inch photomasks are expected in advanced node production by 2033.
- Intel has deployed ASML's High NA EUV technology on its 18A process.
- Intel used ASML's High NA EUV for Core Ultra Series 3 (Panther Lake) processors.
- Intel built over one million wafers using the new process.
✨ This summary was generated by AI from the outlets' reporting listed below. It is not independently verified and may contain errors — check the original sources. How BrevFeed works →
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How outlets covered it
Chinese chip manufacturers are producing advanced processors, such as Huawei's Kirin 9000S and 9030, using deep ultraviolet (DUV) lithography despite export controls on extreme ultraviolet (EUV) machines. This is achieved through multiple patterning techniques, which increase manufacturing complexity, cost, and defect rates compared to EUV. The approach allows China to narrow the technology gap but at a growing expense.
An X user, @lithos_graphein, created and shared building instructions for an 810-piece Lego replica of ASML's TWINSCAN EXE:5000 High-NA EUV machine, which was originally released as an employee-exclusive kit. This fan-made version includes enhanced details and interior components not present in the original, making the design publicly accessible for enthusiasts.
ASML reported record quarterly revenue of $13.06 billion in Q3 2026, driven by high demand for advanced semiconductor manufacturing equipment. The company anticipates demand for its lithography systems will exceed production capacity by 2027-2028, prompting consideration of further capacity expansions.
ASML reports unprecedented demand for its chipmaking tools, with orders extending to 2029 and 2030, driven by the AI boom. The company plans to increase capacity by 60% by 2028 but still anticipates struggling to meet demand, leading to price increases starting in 2027. This indicates sustained growth in the AI industry and continued investment in chip production.
Elon Musk's Terafab is slated to receive its first ASML EUV lithography tool in mid-2027, according to reports. This delivery precedes the completion of the fab's development shell, which is expected in late 2027, indicating the tool will sit idle for several months. The use of a conventional EUV tool suggests Terafab's initial chip production will rely on established technology, specifically Intel's 14A process, rather than experimental free electron laser sources.
ASML reported third-quarter profit that exceeded expectations and noted customer interest in placing orders for its semiconductor tools through 2029 and 2030. This indicates strong long-term demand for ASML's lithography machines, driven by AI-related investments, and has led the company to raise its 2026 sales forecast.
Taiwan Semiconductor Manufacturing Co (TSMC) reported September revenue of $16.03 billion, a 54.6% increase year-over-year, attributed to strong demand for advanced AI chips. This growth reflects the ongoing impact of AI on the semiconductor manufacturing sector.
Chinese chipmakers have acquired an estimated 343 immersion DUV lithography tools between 2012 and early 2026, with many capable of 7nm-class chip production. This accumulation provides China with significant potential for sophisticated processor manufacturing despite restrictions on advanced EUV systems. The report suggests a gap in export controls, as DUV equipment for less advanced processes can be repurposed for more advanced nodes.
ASML, the sole supplier of EUV lithography systems, reported that 0% of its revenue in 2026 came from Europe, a decrease from 1% in 2025 and 5% in 2024. The company is urging EU authorities to stimulate demand for European-made chips to encourage local semiconductor manufacturing investments.
ASML will not adopt free-electron laser (FEL) technology for its extreme ultraviolet (EUV) lithography scanners, opting instead to continue developing its existing laser-produced plasma (LPP) systems. This decision means ASML will focus on increasing the power of its current LPP light sources to 1000W, impacting the future direction of EUV chip manufacturing technology.
TSMC, Samsung, and Intel are working with ASML to transition to 6x12-inch photomasks for High-NA EUV lithography. This change is necessary to enable single-pass printing of large chips, which High-NA EUV's anamorphic optics currently prevent, requiring a stitching process that reduces throughput and complicates design.
Samsung Electronics and TSMC will adopt ASML's high NA EUV photolithography machines and have agreed to a technology change that could increase chip production by 40%. This adoption signifies a broader industry embrace of advanced EUV technology for manufacturing next-generation chips.
TSMC announced plans to begin using High-NA EUV lithography for high-volume manufacturing in 2030, transitioning from current Low-NA EUV systems. This adoption is driven by the increasing complexity of transistor architectures, such as GAA transistors and CFETs, which require more advanced patterning capabilities.
Samsung and TSMC will adopt ASML's High NA extreme ultraviolet (EUV) lithography machines and larger 12-inch photomasks, following Intel's earlier deployment. This move aims to increase production capacity, boost manufacturing yields, and lower chipmaking costs for high-end chips and RAM, potentially addressing current chip shortages.
TSMC and Samsung, the world's largest chipmakers, have committed to using ASML's High NA extreme ultraviolet (EUV) lithography machines for advanced chip production, driven by increasing demand for AI applications. This adoption signifies a move towards more intricate chip designs and improved manufacturing efficiency, with Samsung planning to use the technology for DRAM production from 2028.