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GlobalFoundries Details FDX Fusion Technology for 7nm-Class Performance Without EUV
Key points
- FDX Fusion uses FD-SOI technology for 7nm-class performance.
- It utilizes advanced planar transistors, avoiding EUV lithography.
- Commercial production is planned for 2028, high-volume by 2030.
- Targets connectivity (Wi-Fi, Bluetooth, cellular) and edge processors.
Return to 7nm-Class Performance
GlobalFoundries is re-entering the 7nm-class performance arena with its FDX Fusion process, eight years after discontinuing its 7nm FinFET development. This new approach leverages FD-SOI (fully depleted silicon-on-insulator) technology to achieve performance comparable to 7nm nodes.
FDX Fusion Technology Details
Sudipto Bose, VP of GlobalFoundries' FD-SOI business unit, provided details on FDX Fusion. The technology features 8nm-class logic density and employs advanced planar transistors. A key aspect is its ability to achieve these performance metrics without the need for EUV lithography tools, potentially impacting manufacturing costs and accessibility.
Production Timeline and Market Strategy
GlobalFoundries aims to begin commercial production of FDX Fusion in 2028, with high-volume manufacturing targeted for 2030. The company intends for FDX Fusion to compete with conventional FinFET technologies by offering a different path to advanced performance, building on its existing investment and market traction in FD-SOI.
Target Applications
FDX Fusion is designed to serve applications in connectivity, including Wi-Fi, Bluetooth, cellular, and satcom. Additionally, it targets edge processors such as microcontroller units (MCUs) that incorporate some level of inference capabilities. These applications align with GlobalFoundries' current customer base and strategic focus.
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Reporting from
GlobalFoundries is developing FDX Fusion, a new FD-SOI process technology that aims to deliver 7nm-class performance using planar transistors, without requiring EUV lithography. The company plans for commercial production to begin in 2028, targeting high-volume manufacturing by 2030, and intends for FDX Fusion to serve connectivity and edge processor applications.