● Covered by 1 source · 1 reportMedium impact1 neutral
GlobalFoundries to produce silicon interposers for TSMC's CoWoS in US
Key points
- GlobalFoundries to produce silicon interposers for TSMC's CoWoS.
- Five-year agreement valued at $2 billion.
- US-based manufacturing at Malta, NY facility.
- Volume production begins in first half of 2028.
GlobalFoundries to Manufacture Interposers for TSMC
GlobalFoundries and TSMC have entered into a five-year manufacturing agreement worth $2 billion. Under this agreement, GlobalFoundries will produce silicon interposers for TSMC's CoWoS advanced packaging technology. This partnership aims to establish a US-based manufacturing source for these critical components.
US-Made Branding and Production Timeline
The arrangement will allow TSMC's clients to market their products as entirely manufactured and packaged in America. Volume production is scheduled to commence in the first half of 2028 at GlobalFoundries' facility in Malta, NY. The agreement also provides a framework for potential capacity expansion based on future demand.
Role of Silicon Interposers in Advanced Packaging
Silicon interposers are custom silicon pieces that facilitate high-density connections between logic chiplets and high-bandwidth memory (HBM) stacks. These components are essential for creating complex multi-die processors used in artificial intelligence (AI) and high-performance computing (HPC) applications. The interposers are customized for specific processor designs, considering factors like the number and placement of chiplets and HBM stacks, as well as power delivery and thermal characteristics.
Technical Considerations for Interposer Production
Interposers must meet specific power-delivery requirements, including power distribution networks and embedded deep trench capacitors. Their designs also account for signal integrity, power integrity, and thermal characteristics. For large interposers that exceed lithographic reticle size, stitching techniques are required, and GlobalFoundries' capability in this area for extra-large system-in-packages remains to be seen. GlobalFoundries will act as a subcontractor, manufacturing customer-specific interposer designs.
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Reporting from
GlobalFoundries and TSMC signed a five-year, $2 billion agreement for GlobalFoundries to produce silicon interposers for TSMC's CoWoS advanced packaging technology in the US. This collaboration establishes a domestic manufacturing source for these components, allowing TSMC's clients to brand products as fully US-made and packaged, with volume production starting in early 2028.