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Google's Tensor G6 chip for Pixel 11 uses TSMC's 3nm process, not 2nm as rumored

🔄 Updated 1d ago
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Key points

  • Tensor G6 uses TSMC's 3nm process.
  • Rumors suggested a 2nm process for the chip.
  • CPU offers 25% faster web browsing, 15% quicker app launches.
  • Includes 50% more TPU compute and Gemini Nano support.

Tensor G6 Process Node Confirmed

Google's Tensor G6 chip, intended for the Pixel 11, will be produced using TSMC's 3nm manufacturing process. This information was confirmed by Peng Yu-chun, Google's VP of Hardware, in an interview with CNA. Earlier reports had indicated that the Tensor G6 would be the first smartphone chip to utilize TSMC's 2nm process.

Dispelling 2nm Rumors

Prior to this confirmation, there were expectations that Google would be the first to adopt TSMC's 2nm technology for a smartphone chip, potentially ahead of Apple. The shift from a rumored 2nm to a confirmed 3nm process means the Tensor G6 will not be the first to feature the more advanced node.

Key Upgrades in Tensor G6

Despite not using the 2nm process, the Tensor G6 includes several upgrades. The CPU is reported to offer 25% faster web browsing and 15% quicker app launches. The chip also features 50% more TPU compute, support for a new Gemini Nano on-device AI model, an upgraded Image Signal Processor for faster Night Sight and improved digital zoom, and an upgraded Titan M3 security chip.

Impact on Efficiency

The 2nm process was largely anticipated to deliver significant efficiency improvements, which were rumored to be a primary focus for Google's chip generation. While the 3nm process still offers advancements, the expected efficiency gains from a 2nm node will not be present in the Tensor G6.

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Reporting from

Google's upcoming Tensor G6 chip, set to debut in the Pixel 11, will be manufactured using TSMC's 3nm process, contrary to earlier rumors of it being the first 2nm smartphone chip. This clarification from Google's VP of Hardware confirms the process node for the new chip, which includes CPU, TPU, ISP, and security chip upgrades.