Google's Tensor G6 chip, intended for the Pixel 11, will be produced using TSMC's 3nm manufacturing process. This information was confirmed by Peng Yu-chun, Google's VP of Hardware, in an interview with CNA. Earlier reports had indicated that the Tensor G6 would be the first smartphone chip to utilize TSMC's 2nm process.
Prior to this confirmation, there were expectations that Google would be the first to adopt TSMC's 2nm technology for a smartphone chip, potentially ahead of Apple. The shift from a rumored 2nm to a confirmed 3nm process means the Tensor G6 will not be the first to feature the more advanced node.
Despite not using the 2nm process, the Tensor G6 includes several upgrades. The CPU is reported to offer 25% faster web browsing and 15% quicker app launches. The chip also features 50% more TPU compute, support for a new Gemini Nano on-device AI model, an upgraded Image Signal Processor for faster Night Sight and improved digital zoom, and an upgraded Titan M3 security chip.
The 2nm process was largely anticipated to deliver significant efficiency improvements, which were rumored to be a primary focus for Google's chip generation. While the 3nm process still offers advancements, the expected efficiency gains from a 2nm node will not be present in the Tensor G6.
✨ This summary was generated by AI from the outlets' reporting listed below. It is not independently verified and may contain errors — check the original sources. How BrevFeed works →
One email each morning: the day's tech stories, clustered across outlets and summarized. No account needed.
One email a day. Unsubscribe in one click, any time.
Spend a few minutes, get the whole day. Every topic's top stories in one hands-free rundown — listen, watch, or read the transcript.
▶ Play today's briefNew every morning, and the back catalogue is archived by date.
Google's upcoming Tensor G6 chip, set to debut in the Pixel 11, will be manufactured using TSMC's 3nm process, contrary to earlier rumors of it being the first 2nm smartphone chip. This clarification from Google's VP of Hardware confirms the process node for the new chip, which includes CPU, TPU, ISP, and security chip upgrades.