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Thermal Grizzly Releases PhaseSheet PTM Pro with Improved Thermal Conductivity and Installation
Key points
- PhaseSheet PTM Pro is an improved phase-changing thermal pad.
- Offers increased thermal conductivity and easier installation.
- Transitions to liquid above 45°C, reducing pump-out effect.
- Outperformed several thermal pastes/pads in testing.
New Thermal Pad Release
Thermal Grizzly has introduced the PhaseSheet PTM Pro, an enhanced version of its phase-changing thermal pad. The manufacturer states that this new product features higher thermal conductivity and a redesigned carrier film for easier handling and installation. The carrier film is designed to peel away more easily from both sides, which reduces the risk of tearing during application.
Phase-Changing Technology
Similar to the original PhaseSheet PTM, the Pro version utilizes a phase-changing material. This material remains solid at room temperature but transforms into a low-viscosity liquid when temperatures exceed 45°C, behaving like thermal paste. This characteristic helps to minimize the pump-out effect, a common issue with traditional thermal pastes where the material can migrate from between contact surfaces due to thermal expansion and contraction, potentially degrading cooling over time.
Performance and Features
The PhaseSheet PTM Pro is reusable and electrically non-conductive, making it suitable for use on components without an Integrated Heat Spreader (IHS), such as mobile CPUs, GPUs, memory, and storage. Performance data provided by Thermal Grizzly indicates that the PhaseSheet PTM Pro achieved a temperature difference of 5.83°C in controlled tests (30x30mm contact, 300N force, 240W heat load). This result was lower than KryoSheet (6.13°C), Duronaut Pro (6.29°C), and the original PhaseSheet PTM (6.36°C).
Availability
The PhaseSheet PTM Pro is available for purchase directly from Thermal Grizzly's website. A 40 x 40mm sheet is priced at $23.28.
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Reporting from
Thermal Grizzly launched the PhaseSheet PTM Pro, an updated phase-changing thermal pad with increased thermal conductivity and an easier-to-install carrier film. This new version aims to improve cooling performance and simplify application compared to its predecessor and other thermal interface materials.