Intel Foundry Completes RAMP-C Program for Secure Domestic 18A Chip Production

RAMP-C Program Concludes

Intel Foundry announced the completion of RAMP-C, a United States government program initiated in 2021. The program's objective was to develop a secure, domestic leading-edge chip ecosystem based on Intel's 18A process technology. Its conclusion indicates that Intel is now prepared to accept external customers for full-price fabrication of commercial products.

Facilitating Secure Enclave Manufacturing

The RAMP-C program channeled funds to commercial and defense partners, allowing them to run test chips on an unfinished design kit. This process helped shape the Intel Secure Enclave manufacturing flow, which is designed for defense-focused products. The program's completion marks readiness for customers who will use this secure manufacturing flow, spanning stages from design to chip fabrication and advanced packaging.

Key Partners and Contributions

While no new customers were named, the program's roster included companies such as Nvidia, Microsoft, IBM, Qualcomm, Boeing, and Northrop Grumman. These partners tested prototypes on 18A, providing valuable data on power, performance, area, and cost (PPAC) to Intel and the U.S. government. The funding allowed partners to work with immature Process Design Kits (PDKs), which would not typically be done otherwise.

Advancing Domestic Chip Production

The RAMP-C program is cited by Intel as a key influence on its Secure Enclave offering. The collaboration between Intel, the U.S. government, and its partners through RAMP-C has contributed to the creation of a defense-ready domestic chip source, enhancing national security in semiconductor manufacturing.