LG-PRI enters chip packaging market with maskless Laser Direct Imaging machine

LG Enters Advanced Packaging Equipment Market

LG Electronics Production Technology Institute (LG-PRI) has signed a contract with an outsourced semiconductor assembly and test (OSAT) company to supply a maskless laser direct imaging (LDI) lithography tool. This tool is designed for building metal-interconnect patterns in semiconductor packaging. This marks LG's entry into the advanced packaging equipment sector, a growing area in the semiconductor industry.

LDI System Capabilities

LG-PRI's LDI system is a maskless lithography machine that patterns fine metal interconnects for advanced semiconductor packaging. The highest-resolution version of the machine can produce 1.5-µm line-and-space (L/S) patterns, suitable for wiring pitches of approximately 3 µm. The production equipment uses a 405-nm laser-diode light source and can process substrates up to 600 × 600 mm.

Target Applications and Market Position

LG primarily positions its LDI system for advanced semiconductor packaging using organic and glass substrates, displays, and MEMS. It can also be used for high-density printed circuit boards (PCBs) for mobile devices or prototyping. LG is entering an established direct-imaging market but aims to target the higher end with its 1.5-µm line/space capability and competitive pricing strategy.

Maskless Lithography Explained

Laser Direct Imaging (LDI) is a maskless lithography process. Unlike traditional photolithography that uses a physical photomask, LDI employs a laser to directly expose a digitally generated circuit pattern onto a photoresist-coated substrate. This method uses a digitally controlled pattern generator and projection optics, similar to how a digital image is projected onto a screen, but for circuit patterns on photoresist.